MediaTek today unveiled the Dimensity 9200 5G chipset built using TSMC's 2nd-generation 4nm process.
The chipset consists of an ARM Cortex-X3 core running at 3.05GHz, a trio of ARM Cortex-A715 cores running at 2.85GHz, and four ARM Cortex-A510 cores running at 1.8GHz. MediaTek combined the CPU with LPDDR5X RAM capable of achieving 8,533Mbps data transfer speeds, and each Cortex-A510 core has direct access to storage thanks to UFS 4.0 with Multi-Circular Queue (MCQ) support. There's also support for Full HD+ resolution up to 240Hz, WHQD resolution up to 144Hz, and 5K resolution up to 60Hz.
MediaTek is able to claim a few firsts with this chipset. Dimensity 9200 is the first to run an ARM Cortex X3 at over 3GHz, the first Wi-Fi 7-ready smartphone platform (supports up to 6.5Gbps data rates), the chipset’s Imagiq 890 image signal processor is the first to natively support RGBW sensors (allows for HD image capture in low light, dim, or dull conditions), and the inclusion of support for Bluetooth 5.3 allows it to be the first with studio-grade Bluetooth Audio (24-bit, 192KHz).
Mobile gamers will be happy to hear MediaTek incorporated the first ARM Immortalis-G715 GPU with hardware raytracing (up to four-time faster), and combined it with Motion Blur Reduction, Frame Rate Smoother 2.0, and Adaptive Game technologies as part of MediaTek's HyperEngine 6.0.
The AI capabilities of the chipset are also impressive, especially when it comes to power efficiency. Dimensity 9200 achieves 30% power savings using AI-noise reduction and 45% power savings with AI-super resolution in all visual applications compared to the last generation. The sixth-generation AI processing unit (APU 690) is 35% faster than the fifth generation using the ETHZ 5.0 benchmark.
MediaTek says the first smartphones using Dimensity 9200 will be available before the end of 2022, and the company is running its Dimensity Open Resource Architecture (DORA) program to customize the chipset features for smartphone manufacturers.